Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Shoji Ito0
Masahiro Okamoto0
Osamu Nakao0
Ryoichi Kishihara0
Hiroki Hashiba0
Date of Patent
February 15, 2011
0Patent Application Number
124637080
Date Filed
May 11, 2009
0Patent Primary Examiner
Patent abstract
At least one base material having a wiring circuit that has been formed into a predetermined outer shape is bonded to a motherboard. The motherboard wiring board and the base material having a wiring circuit are electrically connected to each other at least one portion through an inner via hole. The outer shape of the base material having a wiring circuit is smaller than the outer shape of the motherboard, with the base material having a wiring circuit having an island shape on the motherboard.
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