US Patent 7886438 Process for producing multilayer printed wiring board
Patent 7886438 was granted and assigned to Fujikura on February, 2011 by the United States Patent and Trademark Office.
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Patent abstract
At least one base material having a wiring circuit that has been formed into a predetermined outer shape is bonded to a motherboard. The motherboard wiring board and the base material having a wiring circuit are electrically connected to each other at least one portion through an inner via hole. The outer shape of the base material having a wiring circuit is smaller than the outer shape of the motherboard, with the base material having a wiring circuit having an island shape on the motherboard.
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Patent Inventor Names
Hiroki Hashiba0
Masahiro Okamoto0
Osamu Nakao0
Ryoichi Kishihara0
Shoji Ito0
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US Patent 07886438 Process for producing multilayer printed wiring board US Patent 7886438 Process for producing multilayer printed wiring board
Infobox
Patent Number
078864380
Patent Number
78864380
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Official Website
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
078864380
Date of Patent
February 15, 2011
0Patent Application Number
124637080
Date Filed
May 11, 2009
0Official Website
Patent Primary Examiner
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US Patent 07886438 Process for producing multilayer printed wiring board
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07886438
Date of patent
February 15, 2011
Patent application number
12463708
Date Filed
May 11, 2009
Patent primary examiner
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