Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Wai Yew Lo0
Boon Seong Lee0
Kar Yoke Ong0
Date of Patent
February 15, 2011
0Patent Application Number
124361540
Date Filed
May 6, 2009
0Patent Primary Examiner
Patent abstract
A semiconductor package (10) including a pressure sensor die (14) has an interconnect layer (22) formed over a first major surface of the pressure sensor die (14). An encapsulant (18) encapsulates a second major surface and sides of the pressure sensor die (14). A cavity (32) extends through the interconnect layer (22) to the first major surface of the pressure sensor die (14). The interconnect layer (22) allows for the assembly of a low-profile package.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.