US Patent 7886609 Pressure sensor package
Patent 7886609 was granted and assigned to Freescale Semiconductor on February, 2011 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
May 6, 2009
0
Date of Patent
February 15, 2011
0
Patent Application Number
12436154
0
Patent Inventor Names
Wai Yew Lo
0
Boon Seong Lee
0
Kar Yoke Ong
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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