Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 15, 2011
Patent Application Number
12034572
Date Filed
February 20, 2008
Patent Primary Examiner
Patent abstract
A multilayer printed circuit board has an IC chip included in a core substrate in advance, and an intermediate layer provided on a pad of the IC chip. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the intermediate layer made of copper on the die pad, it is possible to prevent resin residues on the pad and to improve connection characteristics between the pad and a via hole, and to improve reliability.
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