US Patent 7888605 Multilayer printed circuit board
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Patent abstract
A multilayer printed circuit board has an IC chip included in a core substrate in advance, and an intermediate layer provided on a pad of the IC chip. Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the intermediate layer made of copper on the die pad, it is possible to prevent resin residues on the pad and to improve connection characteristics between the pad and a via hole, and to improve reliability.
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US Patent 07888605 Multilayer printed circuit board US Patent 7888605 Multilayer printed circuit board
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Patent Number
0788860500
Patent Number
788860500
Edits on 22 May, 2023
Golden AI
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Official Website
Edits on 7 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
078886050
Date of Patent
February 15, 2011
0Patent Application Number
120345720
Date Filed
February 20, 2008
0Official Website
Patent Primary Examiner
Edits on 26 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
078886050
Date of Patent
February 15, 2011
0Patent Application Number
120345720
Date Filed
February 20, 2008
0Official Website
Patent Primary Examiner
Edits on 4 Jun, 2022
Golden AI
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Edits on 6 Dec, 2021
Golden AI
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US Patent 07888605 Multilayer printed circuit board
Infobox
Is a
Patent jurisdiction
Patent number
07888605
Date of patent
February 15, 2011
Patent application number
12034572
Date Filed
February 20, 2008
Patent primary examiner
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