US Patent 7892440 Wet etching process
Patent 7892440 was granted and assigned to University of South Florida on February, 2011 by the United States Patent and Trademark Office.
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Patent abstract
The present invention illustrates a bulk silicon etching technique that yields straight sidewalls, through wafer structures in very short times using standard silicon wet etching techniques. The method of the present invention employs selective porous silicon formation and dissolution to create high aspect ratio structures with straight sidewalls for through wafer MEMS processing.
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Patent Inventor Names
Abdur Rub Abdur Rahman0
Shekhar Bhansali0
Sunny Kedia0
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US Patent 07892440 Wet etching process US Patent 7892440 Wet etching process
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Patent Number
078924400
Patent Number
78924400
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Is a
Current Assignee
Patent Jurisdiction
Patent Number
078924400
Date of Patent
February 22, 2011
0Patent Application Number
118286390
Date Filed
July 26, 2007
0Official Website
Patent Primary Examiner
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US Patent 07892440 Wet etching process
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07892440
Date of patent
February 22, 2011
Patent application number
11828639
Date Filed
July 26, 2007
Patent primary examiner
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