Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chih-Hsien Yeh0
Jiin-Jyh Shyu0
Date of Patent
February 22, 2011
0Patent Application Number
121656280
Date Filed
June 30, 2008
0Patent Primary Examiner
Patent abstract
A lead-free sealing material is provided, which contains a glass with a composition including 47.5-67.5 mole % SnO, 2.5-15 mole % MgO, and 30-40 mole % P2O5. The lead-free sealing material has excellent chemical durability, low melting temperature, and good flowability during heating. The lead-free material is particularly suitable to be used as a sealing material. The lead-free sealing material may additionally contain low-thermal-expansion powdered fillers to reduce the thermal expansion coefficient of the resulting sealing material.
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