US Patent 7892996 Lead-free sealing material
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Patent abstract
A lead-free sealing material is provided, which contains a glass with a composition including 47.5-67.5 mole % SnO, 2.5-15 mole % MgO, and 30-40 mole % P2O5. The lead-free sealing material has excellent chemical durability, low melting temperature, and good flowability during heating. The lead-free material is particularly suitable to be used as a sealing material. The lead-free sealing material may additionally contain low-thermal-expansion powdered fillers to reduce the thermal expansion coefficient of the resulting sealing material.
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Patent Inventor Names
Chih-Hsien Yeh0
Jiin-Jyh Shyu0
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US Patent 07892996 Lead-free sealing material US Patent 7892996 Lead-free sealing material
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Patent Number
078929960
Patent Number
78929960
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Official Website
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Patent Jurisdiction
Patent Number
078929960
Date of Patent
February 22, 2011
0Patent Application Number
121656280
Date Filed
June 30, 2008
0Official Website
Patent Primary Examiner
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US Patent 07892996 Lead-free sealing material
Infobox
Is a
Patent jurisdiction
Patent number
07892996
Date of patent
February 22, 2011
Patent application number
12165628
Date Filed
June 30, 2008
Patent primary examiner
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