US Patent 7893386 Laser micromachining and methods of same

The described embodiments relate to laser micromachining a substrate. One exemplary method includes forming a feature into a substrate, at least in part, by directing a laser beam at the substrate. During at least a portion of said forming, the method includes supplying liquid to at least a first region of the feature along a first liquid supply path and supplying liquid to at least a second different region of the feature along at least a second liquid supply path.