Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Shinichiro Kawabe0
Makoto Honma0
Naoaki Hashimoto0
Noriaki Mukai0
Akio Igarashi0
Date of Patent
March 1, 2011
0Patent Application Number
125435850
Date Filed
August 19, 2009
0Patent Primary Examiner
Patent abstract
Solder bumps formed on an electrode portion of a semiconductor chip are recently miniaturized, and when printing by using solder balls, the solder balls are also miniaturized. Therefore, it is required to print solder balls for printing with accuracy.
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