US Patent 7896223 Solder ball printing apparatus
Patent 7896223 was granted and assigned to Hitachi on March, 2011 by the United States Patent and Trademark Office.
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Patent abstract
Solder bumps formed on an electrode portion of a semiconductor chip are recently miniaturized, and when printing by using solder balls, the solder balls are also miniaturized. Therefore, it is required to print solder balls for printing with accuracy.
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Patent Inventor Names
Akio Igarashi0
Makoto Honma0
Naoaki Hashimoto0
Noriaki Mukai0
Shinichiro Kawabe0
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Official Website
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US Patent 07896223 Solder ball printing apparatus US Patent 7896223 Solder ball printing apparatus
Infobox
Patent Number
078962230
Patent Number
78962230
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
078962230
Date of Patent
March 1, 2011
0Patent Application Number
125435850
Date Filed
August 19, 2009
0Official Website
Patent Primary Examiner
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US Patent 07896223 Solder ball printing apparatus
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07896223
Date of patent
March 1, 2011
Patent application number
12543585
Date Filed
August 19, 2009
Patent primary examiner
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