Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 8, 2011
Patent Application Number
11952951
Date Filed
December 7, 2007
Patent Citations Received
Patent Primary Examiner
Patent abstract
An integrated circuit package system comprising: providing a lead frame; forming an integrated circuit package including the lead frame; providing a selectively exposed area on the lead frame; and coating a conductive shielding layer on the integrated circuit package for coupling the selectively exposed area.
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