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US Patent 7902644 Integrated circuit package system for electromagnetic isolation

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Patent Citations Received
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US Patent 11990382 Fine pitch BVA using reconstituted wafer with area array accessible for testing
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Patent abstract

An integrated circuit package system comprising: providing a lead frame; forming an integrated circuit package including the lead frame; providing a selectively exposed area on the lead frame; and coating a conductive shielding layer on the integrated circuit package for coupling the selectively exposed area.

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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=0790264400
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US Patent 07902644 Integrated circuit package system for electromagnetic isolation US Patent 7902644 Integrated circuit package system for electromagnetic isolation

Infobox
Patent Number
0790264400
Patent Number
790264400
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"Entity importer update"
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edited on 31 Mar, 2023
Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
079026440
Date of Patent
March 8, 2011
0
Patent Application Number
119529510
Date Filed
December 7, 2007
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=079026440
Patent Primary Examiner
‌
Chris Chu
0
Edits on 24 Sep, 2022
"Entity importer update"
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edited on 24 Sep, 2022
Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
079026440
Date of Patent
March 8, 2011
0
Patent Application Number
119529510
Date Filed
December 7, 2007
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=079026440
Patent Primary Examiner
‌
Chris Chu
0
Edits on 4 Jun, 2022
"Entity importer update"
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=07902644
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 US Patent 07902644 Integrated circuit package system for electromagnetic isolation

Infobox
Is a
Patent
Patent
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
07902644
Date of patent
March 8, 2011
Patent application number
11952951
Date Filed
December 7, 2007
Patent primary examiner
‌
Chris Chu

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