Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Erich Thallner0
Date of Patent
March 22, 2011
0Patent Application Number
117700040
Date Filed
June 28, 2007
0Patent Citations Received
Patent Primary Examiner
Patent abstract
The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 μm. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, the volume of which can be changed by supplying or removing pressurising medium, and in that the size of the contact surface between the adhesive membrane and the wafer can be adjusted by changing the workspace volume.
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