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US Patent 7909374 Handling device and handling method for wafers

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Patent Citations Received
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US Patent 12117737 Apparatus and method for cleaning a support structure in a lithographic system
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US Patent 11988244 Electronically-releasable suction cup assembly secured to an appliance
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Patent abstract

The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 μm. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, the volume of which can be changed by supplying or removing pressurising medium, and in that the size of the contact surface between the adhesive membrane and the wafer can be adjusted by changing the workspace volume.

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Patent Inventor Names
Erich Thallner0
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US Patent 11746823 Electronically-releasable suction cup assembly secured to an appliance
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=079093740
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US Patent 07909374 Handling device and handling method for wafers US Patent 7909374 Handling device and handling method for wafers

Infobox
Patent Number
079093740
Patent Number
79093740
Edits on 23 Sep, 2022
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Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
079093740
Date of Patent
March 22, 2011
0
Patent Application Number
117700040
Date Filed
June 28, 2007
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=079093740
Patent Primary Examiner
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Dean J Kramer
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https://pdfpiw.uspto.gov/.piw?Docid=07909374
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 US Patent 07909374 Handling device and handling method for wafers

Infobox
Is a
Patent
Patent
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
07909374
Date of patent
March 22, 2011
Patent application number
11770004
Date Filed
June 28, 2007
Patent primary examiner
‌
Dean J Kramer

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