Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chihwei Lin0
Chun-Hui Yu0
Wen-Kun Yang0
Date of Patent
March 22, 2011
0Patent Application Number
116474480
Date Filed
December 29, 2006
0Patent Citations Received
Patent Primary Examiner
Patent abstract
The present invention discloses a structure of package comprising: a substrate with a die receiving through hole; a base attached on a lower surface of the substrate; a die disposed within the die receiving through hole and attached on the base; a dielectric layer formed on the die and the substrate; a re-distribution layer (RDL) formed on the dielectric layer and coupled to the die; a protection layer formed over the RDL; and pluralities of pads formed on the protection layer and coupled to the RDL. The RDL is made from an alloy comprising Ti/Cu/Au alloy or Ti/Cu/Ni/Au alloy.
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