US Patent 7911044 RF module package for releasing stress
Is a
Date Filed
December 29, 2006
0
Date of Patent
March 22, 2011
0
Patent Application Number
11647448
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Patent Inventor Names
Chihwei Lin
0
Chun-Hui Yu
0
Wen-Kun Yang
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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