US Patent 7918712 Endpoint detection system for wafer polishing
Patent 7918712 was granted and assigned to Strasbaugh on April, 2011 by the United States Patent and Trademark Office.
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Patent abstract
An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off the pad through non-contact couplings such inductive coupling or optical couplings after being converted into signal formats enabling non-contact transmission.
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US Patent 07918712 Endpoint detection system for wafer polishing US Patent 7918712 Endpoint detection system for wafer polishing
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Patent Number
0791871200
Patent Number
791871200
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Official Website
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079187120
Date of Patent
April 5, 2011
0Patent Application Number
127050910
Date Filed
February 12, 2010
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079187120
Date of Patent
April 5, 2011
0Patent Application Number
127050910
Date Filed
February 12, 2010
0Official Website
Patent Primary Examiner
Edits on 19 Jun, 2022
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US Patent 07918712 Endpoint detection system for wafer polishing
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07918712
Date of patent
April 5, 2011
Patent application number
12705091
Date Filed
February 12, 2010
Patent primary examiner
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