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US Patent 7923125 Apparatus for solder crack deflection

Patent 7923125 was granted and assigned to Intel on April, 2011 by the United States Patent and Trademark Office.

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Patent abstract

An apparatus that includes a first component defining an interior of the apparatus; a first solder composition exterior to the first component; a second solder composition exterior to the first solder composition and the first component; and a second component exterior to the second solder composition, the first solder composition, and the first component.

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