US Patent 7923125 Apparatus for solder crack deflection
Patent 7923125 was granted and assigned to Intel on April, 2011 by the United States Patent and Trademark Office.
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Patent abstract
An apparatus that includes a first component defining an interior of the apparatus; a first solder composition exterior to the first component; a second solder composition exterior to the first solder composition and the first component; and a second component exterior to the second solder composition, the first solder composition, and the first component.
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Patent Inventor Names
Chung C. Key0
Mustapha Mohd. Faizul0
Tan Siew Sang0
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US Patent 07923125 Apparatus for solder crack deflection US Patent 7923125 Apparatus for solder crack deflection
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Patent Number
079231250
Patent Number
79231250
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Official Website
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079231250
Date of Patent
April 12, 2011
0Patent Application Number
117179020
Date Filed
March 13, 2007
0Official Website
Patent Primary Examiner
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US Patent 07923125 Apparatus for solder crack deflection
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07923125
Date of patent
April 12, 2011
Patent application number
11717902
Date Filed
March 13, 2007
Patent primary examiner
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