Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
April 19, 2011
Patent Application Number
09928737
Date Filed
August 13, 2001
Patent Primary Examiner
Patent abstract
A semiconductor package substrate (11) has an array of package sites (13, 14, 16, and 21) that are substantially identical. The entire array of package sites (13, 14, 16, and 21) is covered by an encapsulant (19). The individual package sites (13, 14, 16, and 21) are singulated by sawing through the encapsulant (19) and the underlying semiconductor package substrate (11).
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