US Patent 7927927 Semiconductor package and method therefor
Patent 7927927 was granted and assigned to Freescale Semiconductor on April, 2011 by the United States Patent and Trademark Office.
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Patent abstract
A semiconductor package substrate (11) has an array of package sites (13, 14, 16, and 21) that are substantially identical. The entire array of package sites (13, 14, 16, and 21) is covered by an encapsulant (19). The individual package sites (13, 14, 16, and 21) are singulated by sawing through the encapsulant (19) and the underlying semiconductor package substrate (11).
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US Patent 07927927 Semiconductor package and method therefor US Patent 7927927 Semiconductor package and method therefor
Infobox
Patent Number
0792792700
Patent Number
792792700
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079279270
Date of Patent
April 19, 2011
0Patent Application Number
099287370
Date Filed
August 13, 2001
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079279270
Date of Patent
April 19, 2011
0Patent Application Number
099287370
Date Filed
August 13, 2001
0Official Website
Patent Primary Examiner
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US Patent 07927927 Semiconductor package and method therefor
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07927927
Date of patent
April 19, 2011
Patent application number
09928737
Date Filed
August 13, 2001
Patent primary examiner
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