US Patent 7939918 Chip packages with covers
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Edits on 27 Nov, 2023
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Patent abstract
This invention discloses a crystalline substrate based device including a crystalline substrate having formed thereon a microstructure; and at least one packaging layer which is sealed over the microstructure by means of an adhesive and defines therewith at least one gap between the crystalline substrate and the at least one packaging layer. A method of producing a crystalline substrate based device is also disclosed.
Edits on 23 May, 2023
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US Patent 07939918 Chip packages with covers US Patent 7939918 Chip packages with covers
Infobox
Patent Number
0793991800
Patent Number
793991800
Edits on 5 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
079399180
Date of Patent
May 10, 2011
0Patent Application Number
115884890
Date Filed
October 26, 2006
0Patent Primary Examiner
Edits on 26 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
079399180
Date of Patent
May 10, 2011
0Patent Application Number
115884890
Date Filed
October 26, 2006
0Patent Primary Examiner
Edits on 7 Dec, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 07939918 Chip packages with covers
Infobox
Is a
Patent jurisdiction
Patent number
07939918
Date of patent
May 10, 2011
Patent application number
11588489
Date Filed
October 26, 2006
Patent primary examiner
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