US Patent 7939940 Multilayer chip scale package

Patent 7939940 was granted and assigned to Omnivision Technologies, Inc. on May, 2011 by the United States Patent and Trademark Office.

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Patent

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Current Assignee

Omnivision Technologies, Inc.

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

79399400

Patent Inventor Names

Jari Hiltunen0

Date of Patent

May 10, 2011

Patent Application Number

119592600

Date Filed

December 18, 2007

Patent Primary Examiner

‌

Edward Wojciechowicz

Patent abstract

A resin coated copper foil is used to fabricate a multilayer Chip Scale Package (CSP). A CSP package base has a first electrical routing layer. A resin coated copper foil is hot pressed onto the CSP package base and then patterned to form a second electrical routing layer. Conductive vias are then formed between the electrical routing layers. An Organic Solder Preservative (OSP) is used a surface finish for solder balls of the CSP.

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