US Patent 7939940 Multilayer chip scale package
Patent 7939940 was granted and assigned to Omnivision Technologies, Inc. on May, 2011 by the United States Patent and Trademark Office.
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Patent abstract
A resin coated copper foil is used to fabricate a multilayer Chip Scale Package (CSP). A CSP package base has a first electrical routing layer. A resin coated copper foil is hot pressed onto the CSP package base and then patterned to form a second electrical routing layer. Conductive vias are then formed between the electrical routing layers. An Organic Solder Preservative (OSP) is used a surface finish for solder balls of the CSP.
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Patent Inventor Names
Jari Hiltunen0
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US Patent 07939940 Multilayer chip scale package US Patent 7939940 Multilayer chip scale package
Infobox
Patent Number
079399400
Patent Number
79399400
Edits on 27 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079399400
Date of Patent
May 10, 2011
0Patent Application Number
119592600
Date Filed
December 18, 2007
0Patent Primary Examiner
Edits on 7 Dec, 2021
Golden AI
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Infobox (+8 properties)
US Patent 07939940 Multilayer chip scale package
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07939940
Date of patent
May 10, 2011
Patent application number
11959260
Date Filed
December 18, 2007
Patent primary examiner
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