Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 7, 2011
Patent Application Number
12543128
Date Filed
August 18, 2009
Patent Primary Examiner
Patent abstract
A post-CMP cleaning process of a copper layer is to be performed as follows. An alkaline aqueous solution, a polycarboxylic acid, BTA, and an alkaline aqueous solution are sequentially brought into contact with a primary surface of a silicon substrate over which the copper layer is provided.
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