US Patent 7955980 Method of manufacturing semiconductor device
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Patent abstract
A post-CMP cleaning process of a copper layer is to be performed as follows. An alkaline aqueous solution, a polycarboxylic acid, BTA, and an alkaline aqueous solution are sequentially brought into contact with a primary surface of a silicon substrate over which the copper layer is provided.
Edits on 25 May, 2023
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US Patent 07955980 Method of manufacturing semiconductor device US Patent 7955980 Method of manufacturing semiconductor device
Infobox
Patent Number
0795598000
Patent Number
795598000
Edits on 23 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
079559800
Date of Patent
June 7, 2011
0Patent Application Number
125431280
Date Filed
August 18, 2009
0Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
079559800
Date of Patent
June 7, 2011
0Patent Application Number
125431280
Date Filed
August 18, 2009
0Patent Primary Examiner
Edits on 7 Dec, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 07955980 Method of manufacturing semiconductor device
Infobox
Is a
Patent jurisdiction
Patent number
07955980
Date of patent
June 7, 2011
Patent application number
12543128
Date Filed
August 18, 2009
Patent primary examiner
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