US Patent 7956462 Semiconductor device and manufacturing method thereof
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Edits on 28 Nov, 2023
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Patent abstract
A semiconductor device having a multilayer wiring structure and a manufacturing method thereof are provided. A semiconductor device and a manufacturing method thereof are provided in which the reliability and the manufacturing yield are high and the design constraint is small. Wirings are formed on a substrate. Low dielectric constant films are formed around the wirings. Reinforcement insulating films are formed in a dielectric material of a larger elastic modulus than that of a formation material of the low dielectric constant films and are arranged to overlap with the wirings when viewed perpendicularly to a substrate surface. Reinforcement insulating films are arranged to intersect with the wirings.
Edits on 18 May, 2023
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US Patent 07956462 Semiconductor device and manufacturing method thereof US Patent 7956462 Semiconductor device and manufacturing method thereof
Infobox
Patent Number
0795646200
Patent Number
795646200
Edits on 22 Mar, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
079564620
Date of Patent
June 7, 2011
0Patent Application Number
120318360
Date Filed
February 15, 2008
0Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
079564620
Date of Patent
June 7, 2011
0Patent Application Number
120318360
Date Filed
February 15, 2008
0Patent Primary Examiner
Edits on 7 Dec, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 07956462 Semiconductor device and manufacturing method thereof
Infobox
Is a
Patent jurisdiction
Patent number
07956462
Date of patent
June 7, 2011
Patent application number
12031836
Date Filed
February 15, 2008
Patent primary examiner
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