Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 28, 2011
Patent Application Number
11796201
Date Filed
April 27, 2007
Patent Primary Examiner
Patent abstract
An electroless plating apparatus is provided. The electroless plating apparatus includes a wafer holder; a chemical dispensing nozzle over the wafer holder; a conduit connected to the chemical dispensing nozzle; and a radiation source over the wafer holder.
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