Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
JooSang Kim0
DongSoo Moon0
Jong-Woo Ha0
Date of Patent
June 28, 2011
Patent Application Number
12114744
Date Filed
May 2, 2008
Patent Primary Examiner
Patent abstract
An integrated circuit package on package system including: forming a first substrate assembly; forming a second substrate, having an auxiliary access port, supported by the first substrate assembly; exposing an integrated circuit die through the auxiliary access port; and coupling an external integrated circuit on the second substrate.
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