US Patent 7968373 Integrated circuit package on package system
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Patent abstract
An integrated circuit package on package system including: forming a first substrate assembly; forming a second substrate, having an auxiliary access port, supported by the first substrate assembly; exposing an integrated circuit die through the auxiliary access port; and coupling an external integrated circuit on the second substrate.
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Patent Inventor Names
DongSoo Moon0
Jong-Woo Ha0
JooSang Kim0
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US Patent 07968373 Integrated circuit package on package system US Patent 7968373 Integrated circuit package on package system
Infobox
Patent Number
07968373
Patent Number
7968373
Edits on 8 Dec, 2021
Golden AI
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US Patent 07968373 Integrated circuit package on package system
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Is a
Patent jurisdiction
Patent number
07968373
Date of patent
June 28, 2011
Patent application number
12114744
Date Filed
May 2, 2008
Patent primary examiner
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