Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Seng Guan Chow0
Il Kwon Shim0
Ming Ying0
Roger Emigh0
Date of Patent
June 28, 2011
0Patent Application Number
111627850
Date Filed
September 22, 2005
0Patent Primary Examiner
Patent abstract
An integrated circuit package system is provided. A protruding pad is formed on a leadframe. A die is attached to the leadframe. The die is electrically connected to the leadframe. At least portions of the leadframe, the protruding pad, and the die are encapsulated in an encapsulant.
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