US Patent 7968377 Integrated circuit protruding pad package system
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Edits on 28 Nov, 2023
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Patent abstract
An integrated circuit package system is provided. A protruding pad is formed on a leadframe. A die is attached to the leadframe. The die is electrically connected to the leadframe. At least portions of the leadframe, the protruding pad, and the die are encapsulated in an encapsulant.
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Patent Inventor Names
Il Kwon Shim0
Ming Ying0
Roger Emigh0
Seng Guan Chow0
Edits on 18 May, 2023
Golden AI
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US Patent 07968377 Integrated circuit protruding pad package system US Patent 7968377 Integrated circuit protruding pad package system
Infobox
Patent Number
079683770
Patent Number
79683770
Edits on 28 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
079683770
Date of Patent
June 28, 2011
0Patent Application Number
111627850
Date Filed
September 22, 2005
0Patent Primary Examiner
Edits on 8 Dec, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 07968377 Integrated circuit protruding pad package system
Infobox
Is a
Patent jurisdiction
Patent number
07968377
Date of patent
June 28, 2011
Patent application number
11162785
Date Filed
September 22, 2005
Patent primary examiner
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