Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kenya Ito0
Hiroaki Kusa0
Masaya Seki0
Tamami Takahashi0
Date of Patent
July 12, 2011
0Patent Application Number
122131860
Date Filed
June 16, 2008
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A polishing apparatus is suitable for use in polishing a periphery of a substrate, such as a semiconductor wafer. The polishing apparatus includes a holding section configured to hold a workpiece and a polishing head configured to bring a polishing tape into contact with the workpiece. The polishing apparatus also includes a supply reel configured to supply the polishing tape to the polishing head, a rewind reel configured to rewind the polishing tape that has contacted the workpiece, and a swinging mechanism configured to cause the polishing head to perform a swinging motion with its pivot at a predetermined point.
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