US Patent 7976361 Polishing apparatus and polishing method
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Patent abstract
A polishing apparatus is suitable for use in polishing a periphery of a substrate, such as a semiconductor wafer. The polishing apparatus includes a holding section configured to hold a workpiece and a polishing head configured to bring a polishing tape into contact with the workpiece. The polishing apparatus also includes a supply reel configured to supply the polishing tape to the polishing head, a rewind reel configured to rewind the polishing tape that has contacted the workpiece, and a swinging mechanism configured to cause the polishing head to perform a swinging motion with its pivot at a predetermined point.
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Patent Inventor Names
Hiroaki Kusa0
Kenya Ito0
Masaya Seki0
Tamami Takahashi0
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US Patent 07976361 Polishing apparatus and polishing method US Patent 7976361 Polishing apparatus and polishing method
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Patent Number
079763610
Patent Number
79763610
Edits on 29 Apr, 2023
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Is a
Patent Jurisdiction
Patent Number
079763610
Date of Patent
July 12, 2011
0Patent Application Number
122131860
Date Filed
June 16, 2008
0Patent Primary Examiner
Edits on 8 Dec, 2021
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US Patent 07976361 Polishing apparatus and polishing method
Infobox
Is a
Patent jurisdiction
Patent number
07976361
Date of patent
July 12, 2011
Patent application number
12213186
Date Filed
June 16, 2008
Patent primary examiner
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