Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Timothy J. Frey0
Christine H. Tsau0
John R. Martin0
Date of Patent
July 19, 2011
0Patent Application Number
124348860
Date Filed
May 4, 2009
0Patent Primary Examiner
Patent abstract
A microchip has a bonding material that bonds a first substrate to a second substrate. The bonding material has, among other things, a rare earth metal and other material.
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