US Patent 7981765 Substrate bonding with bonding material having rare earth metal
Patent 7981765 was granted and assigned to Analog Devices on July, 2011 by the United States Patent and Trademark Office.
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Patent abstract
A microchip has a bonding material that bonds a first substrate to a second substrate. The bonding material has, among other things, a rare earth metal and other material.
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Infobox (+3 properties)
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Patent Inventor Names
Christine H. Tsau0
John R. Martin0
Timothy J. Frey0
Edits on 22 May, 2023
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US Patent 07981765 Substrate bonding with bonding material having rare earth metal US Patent 7981765 Substrate bonding with bonding material having rare earth metal
Infobox
Patent Number
079817650
Patent Number
79817650
Edits on 26 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
079817650
Date of Patent
July 19, 2011
0Patent Application Number
124348860
Date Filed
May 4, 2009
0Patent Primary Examiner
Edits on 8 Dec, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 07981765 Substrate bonding with bonding material having rare earth metal
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07981765
Date of patent
July 19, 2011
Patent application number
12434886
Date Filed
May 4, 2009
Patent primary examiner
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