Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 9, 2011
Patent Application Number
12236567
Date Filed
September 24, 2008
Patent Primary Examiner
Patent abstract
A method for manufacturing a semiconductor device, includes: preparing a semiconductor substrate with a first notch; preparing a supporting substrate with a second notch; laminating the semiconductor substrate with the supporting substrate so that the first notch can be matched with the second notch; and processing a second main surface of the semiconductor substrate opposite to a first main surface thereof facing to the supporting substrate to reduce a thickness of the semiconductor substrate to a predetermined thickness.
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