US Patent 7993974 Method for manufacturing a semiconductor device
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Edits on 28 Nov, 2023
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Patent abstract
A method for manufacturing a semiconductor device, includes: preparing a semiconductor substrate with a first notch; preparing a supporting substrate with a second notch; laminating the semiconductor substrate with the supporting substrate so that the first notch can be matched with the second notch; and processing a second main surface of the semiconductor substrate opposite to a first main surface thereof facing to the supporting substrate to reduce a thickness of the semiconductor substrate to a predetermined thickness.
Edits on 21 May, 2023
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US Patent 07993974 Method for manufacturing a semiconductor device US Patent 7993974 Method for manufacturing a semiconductor device
Infobox
Patent Number
0799397400
Patent Number
799397400
Edits on 24 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
079939740
Date of Patent
August 9, 2011
0Patent Application Number
122365670
Date Filed
September 24, 2008
0Patent Primary Examiner
Edits on 24 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
079939740
Date of Patent
August 9, 2011
0Patent Application Number
122365670
Date Filed
September 24, 2008
0Patent Primary Examiner
Edits on 8 Dec, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 07993974 Method for manufacturing a semiconductor device
Infobox
Is a
Patent jurisdiction
Patent number
07993974
Date of patent
August 9, 2011
Patent application number
12236567
Date Filed
September 24, 2008
Patent primary examiner
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