Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hirohiko Nakata0
Masuhiro Natsuhara0
Akira Kuibira0
Date of Patent
August 16, 2011
0Patent Application Number
104891740
Date Filed
February 26, 2003
0Patent Primary Examiner
Patent abstract
A heating device for manufacturing semiconductor capable of uniformly heating a wafer or other materials to be treated, and in particular a heating device in a coater-developer used for heat-hardening of resin film for photolithography and for heat-calcining of low-dielectric constant insulating film, is provided.
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