Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Paul A. Silvestri0
Date of Patent
August 16, 2011
Patent Application Number
12197869
Date Filed
August 25, 2008
Patent Primary Examiner
Patent abstract
High density circuit modules are formed by stacking integrated circuit (IC) chips one above another. Unused input/output (I/O) locations on some of the chips can be used to connect other I/O locations, resulting in decreased impedance between the chips. Additional apparatus, systems, and methods are disclosed.
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