US Patent 8001513 Integrated circuit apparatus, systems, and methods
Patent 8001513 was granted and assigned to Micron Technology on August, 2011 by the United States Patent and Trademark Office.
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Patent abstract
High density circuit modules are formed by stacking integrated circuit (IC) chips one above another. Unused input/output (I/O) locations on some of the chips can be used to connect other I/O locations, resulting in decreased impedance between the chips. Additional apparatus, systems, and methods are disclosed.
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Patent Inventor Names
Paul A. Silvestri0
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US Patent 08001513 Integrated circuit apparatus, systems, and methods US Patent 8001513 Integrated circuit apparatus, systems, and methods
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Patent Number
08001513
Patent Number
8001513
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US Patent 08001513 Integrated circuit apparatus, systems, and methods
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Is a
Current assignee
Patent jurisdiction
Patent number
08001513
Date of patent
August 16, 2011
Patent application number
12197869
Date Filed
August 25, 2008
Patent primary examiner
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