Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Matthew A. Simpson0
Richard R. Hengst0
Yeshwanth Narendar0
Date of Patent
September 13, 2011
Patent Application Number
11210247
Date Filed
August 23, 2005
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor processing component includes a substrate and a layer overlying the substrate. The layer has a composition ReAyO1.5+2y, wherein Re is Y, La, a Lanthanoid series element, or a combination thereof, A is (Si1−aGea), 0.25≦y≦1.2, and 0≦a≦1.
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