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US Patent 8022309 Flexible printed circuit board

Patent 8022309 was granted and assigned to Hon Hai Precision Industry Co Ltd on September, 2011 by the United States Patent and Trademark Office.

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Patent attributes

Current Assignee

Hon Hai Precision Industry Co Ltd

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Shou-Kuo Hsu0

Chien-Hung Liu0

Yu-Chang Pai0

Date of Patent

September 20, 2011

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Patent Application Number

119468590

Date Filed

November 29, 2007

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Patent Citations Received

US Patent 11842958 Conductive structure including copper-phosphorous alloy and a method of manufacturing conductive structure

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US Patent 12087662 Semiconductor package structure having thermal management structure

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US Patent 11749880 Electronic device including high-frequency transmission circuit

Patent Primary Examiner

Ishwarbhai Patel

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Patent abstract

An exemplary FPCB includes a signal layer having a differential pair consisting of two transmission lines arranged therein, a ground layer, and a dielectric layer lying between the signal layer and the ground layer. Two sheets made of conductive materials are respectively arranged at opposite sides of the differential pair, and both connected to ground. The sheets are apart from and parallel to the transmission lines. The ground layer has a void defined therein, and the void is located under the two transmission lines.

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