US Patent 8022309 Flexible printed circuit board
Patent 8022309 was granted and assigned to Hon Hai Precision Industry Co Ltd on September, 2011 by the United States Patent and Trademark Office.
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Patent abstract
An exemplary FPCB includes a signal layer having a differential pair consisting of two transmission lines arranged therein, a ground layer, and a dielectric layer lying between the signal layer and the ground layer. Two sheets made of conductive materials are respectively arranged at opposite sides of the differential pair, and both connected to ground. The sheets are apart from and parallel to the transmission lines. The ground layer has a void defined therein, and the void is located under the two transmission lines.
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Patent Inventor Names
Chien-Hung Liu0
Shou-Kuo Hsu0
Yu-Chang Pai0
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US Patent 08022309 Flexible printed circuit board US Patent 8022309 Flexible printed circuit board
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Patent Number
080223090
Patent Number
80223090
Edits on 24 Apr, 2023
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Is a
Current Assignee
Patent Jurisdiction
Patent Number
080223090
Date of Patent
September 20, 2011
0Patent Application Number
119468590
Date Filed
November 29, 2007
0Patent Primary Examiner
Edits on 13 Dec, 2021
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US Patent 08022309 Flexible printed circuit board
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
08022309
Date of patent
September 20, 2011
Patent application number
11946859
Date Filed
November 29, 2007
Patent primary examiner
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