Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Weng-Jin Wu0
Hung-Jung Tu0
Ku-Feng Yang0
Wen-Chih Chiou0
Chen-Hua Yu0
Date of Patent
November 8, 2011
0Patent Application Number
128781120
Date Filed
September 9, 2010
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor structure includes a first die comprising a first substrate and a first bonding pad over the first substrate, a second die having a first surface and a second surface opposite the first surface, wherein the second die is stacked on the first die and a protection layer having a vertical portion on a sidewall of the second die, and a horizontal portion extending over the first die.
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