US Patent 8053277 Three-dimensional integrated circuits with protection layers
Is a
Date Filed
September 9, 2010
0
Date of Patent
November 8, 2011
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Patent Application Number
12878112
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Patent Citations Received
Patent Inventor Names
Weng-Jin Wu
0
Hung-Jung Tu
0
Ku-Feng Yang
0
Wen-Chih Chiou
0
Chen-Hua Yu
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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