Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hermann Wendt0
Philipp Riess0
Erdem Kaltalioglu0
Date of Patent
November 22, 2011
0Patent Application Number
120516440
Date Filed
March 19, 2008
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Structures and methods of forming metallization layers on a semiconductor component are disclosed. The method includes etching a metal line trench using a metal line mask, and etching a via trench using a via mask after etching the metal line trench. The via trench is etched only in regions common to both the metal line mask and the via mask.
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