Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kentaro Kumazawa0
Yoshihiro Tomura0
Kojiro Nakamura0
Date of Patent
December 20, 2011
0Patent Application Number
124868410
Date Filed
June 18, 2009
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A mounting structure of the present invention includes a semiconductor element 101, a circuit board 301 having electrodes 302 opposed to electrodes 102 of the semiconductor element 101, and conductive two-layer bumps 213. Second bumps 210 joined to the electrodes 302 of the circuit board 301 are formed larger than first bumps 209 joined to the electrodes 102 of the semiconductor element 101. The axis of the first bump 209 and the axis of the second bump 210 are not aligned with each other.
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